Datasheet

Table 47. Power consumption operating behaviors (continued)
Symbol Description Typ. Max. Unit Notes
85 °C 4000 5546
105 °C 9760 12709
I
DD_VLLS0
VLLS0 current, all peripheral
disabled,
(SMC_STOPCTRL[PORPO] = 1),
VDD = 3 V
25 °C and
below
272 520 nA
50 °C 743 1398
70 °C 1700 2927
85 °C 3650 5177
105 °C 9300 12191
I
DD_VBAT
Average current with RTC and 32
kHz disabled at 3 V
25 °C and
below
160 218.10 nA
50 °C 269 366.96
70 °C 483 714.32
85 °C 851 1211.88
105 °C 1870 2715.16
I
DD_VBAT
Average current with RTC and 32
kHz disabled at 1.8 V
25 °C and
below
137 195.10 nA
50 °C 230 327.96
70 °C 422 653.32
85 °C 746 1106.88
105 °C 1660 2505.16
I
DD_VBAT
Average current when CPU is not
accessing RTC register at 3.0 V
including 32 kHz
25 °C and
below
676 784.00 nA
50 °C 809 1013.00
70 °C 1040 1538.08
85 °C 1420 2022.17
105 °C 2460 3571.81
I
DD_VBAT
Average current when CPU is not
accessing RTC register at 1.8 V
including 32 kHz
25 °C and
below
556 664.00 nA
50 °C 674 878.00
70 °C 880 1378.08
85 °C 1220 1822.17
105 °C 2160 3271.81
1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See
each module's specification for its supply current.
2. CoreMark benchmark compiled using IAR 7.40 with optimization level high, optimized for balanced.
3. MCG configured for PEE mode.
4. MCG configured for FEE mode.
5. MCG configured for PBE mode.
6. MCG configured for BLPE mode.
7. MCG configured for FEI mode.
Electrical characteristics
80
Kinetis KL82 Microcontroller, Rev. 3, 08/2016
NXP Semiconductors