Datasheet

Table of Contents
1 Ordering information............................................................... 5
2 Overview................................................................................. 5
2.1 System features...............................................................7
2.1.1 ARM Cortex-M0+ core...................................... 7
2.1.2 NVIC..................................................................7
2.1.3 AWIC.................................................................7
2.1.4 Memory............................................................. 8
2.1.5 Reset and boot..................................................9
2.1.6 Clock options.....................................................11
2.1.7 Security............................................................. 14
2.1.8 Power management..........................................15
2.1.9 LLWU................................................................ 16
2.1.10 Debug controller................................................18
2.1.11 INTMUX............................................................ 18
2.1.12 Watch dog.........................................................18
2.2 Peripheral features.......................................................... 19
2.2.1 BME.................................................................. 19
2.2.2 eDMA and DMAMUX........................................ 19
2.2.3 TPM...................................................................20
2.2.4 ADC...................................................................21
2.2.5 VREF.................................................................21
2.2.6 CMP.................................................................. 22
2.2.7 RTC...................................................................22
2.2.8 PIT.....................................................................23
2.2.9 LPTMR..............................................................23
2.2.10 CRC.................................................................. 24
2.2.11 LPUART............................................................24
2.2.12 SPI.................................................................... 25
2.2.13 I2C.....................................................................25
2.2.14 USB...................................................................26
2.2.15 FlexIO................................................................27
2.2.16 DAC...................................................................27
2.2.17 EMV-SIM...........................................................28
2.2.18 LTC................................................................... 29
2.2.19 TRNG................................................................29
2.2.20 TSI.....................................................................29
2.2.21 QuadSPI............................................................30
3 Memory map........................................................................... 30
4 Pinouts.................................................................................... 32
4.1 KL82 signal multiplexing and pin assignments................32
4.2 Pin properties.................................................................. 37
4.3 Module signal description tables..................................... 42
4.3.1 Core Modules....................................................42
4.3.2 System modules................................................42
4.3.3 Clock Modules...................................................44
4.3.4 Memories and memory interfaces.....................44
4.3.5 Analog...............................................................45
4.3.6 Timer Modules.................................................. 46
4.3.7 Communication interfaces.................................48
4.3.8 Human-machine interfaces (HMI)..................... 51
4.4 KL82 Pinouts................................................................... 51
4.5 Package dimensions....................................................... 57
5 Electrical characteristics..........................................................64
5.1 Terminology and guidelines.............................................64
5.1.1 Definitions......................................................... 65
5.1.2 Examples.......................................................... 65
5.1.3 Typical-value conditions....................................66
5.1.4 Relationship between ratings and operating
requirements..................................................... 66
5.1.5 Guidelines for ratings and operating
requirements..................................................... 67
5.2 Ratings............................................................................ 67
5.2.1 Thermal handling ratings...................................67
5.2.2 Moisture handling ratings.................................. 68
5.2.3 ESD handling ratings........................................ 68
5.2.4 Voltage and current operating ratings............... 68
5.3 General............................................................................69
5.3.1 AC electrical characteristics.............................. 69
5.3.2 Nonswitching electrical specifications............... 69
5.3.3 Switching specifications.................................... 83
5.3.4 Thermal specifications...................................... 84
5.4 Peripheral operating requirements and behaviors...........86
5.4.1 Core modules....................................................86
5.4.2 Clock modules...................................................88
5.4.3 Memories and memory interfaces.....................95
5.4.4 Security and integrity modules.......................... 101
5.4.5 Analog...............................................................101
5.4.6 Timers............................................................... 112
5.4.7 Communication interfaces.................................112
5.4.8 Human-machine interfaces (HMI)..................... 123
6 Design considerations.............................................................124
6.1 Hardware design considerations..................................... 124
6.1.1 Printed circuit board recommendations.............124
6.1.2 Power delivery system...................................... 124
6.1.3 Analog design................................................... 125
6.1.4 Digital design.....................................................126
6.1.5 Crystal oscillator................................................128
6.2 Software considerations.................................................. 130
6.3 Soldering temperature..................................................... 131
7 Part identification.....................................................................131
7.1 Description.......................................................................131
7.2 Format............................................................................. 131
7.3 Fields............................................................................... 131
7.4 Example...........................................................................132
8 Revision history.......................................................................132
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Kinetis KL82 Microcontroller, Rev. 3, 08/2016
NXP Semiconductors