Datasheet

For all other partner-developed software and tools, visit http://www.nxp.com/partners.
6.3 Soldering temperature
Base on JEDEC/IPC J-STD-020 Industry Standard, refer to AN3298: Solder Joint
Temperature and Package Peak Temperature for soldering guideline of different
packages.
7 Part identification
7.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
7.2
Format
Part numbers for this device have the following format:
Q KL## A FFF R T PP CC N
7.3
Fields
This table lists the possible values for each field in the part number (not all
combinations are valid):
Field Description Values
Q Qualification status • M = Fully qualified, general market flow
• P = Prequalification
KL## Kinetis KL family • KL82
A Key attribute • Z = Cortex-M0+
FFF Program flash memory size • 128 = 128 KB
R Silicon revision • (Blank) = Main
• A = Revision after main
T Temperature range (°C) • V = –40 to 105
PP Package identifier • LH = 64 LQFP (10 mm x 10 mm)
Table continues on the next page...
Part identification
Kinetis KL82 Microcontroller, Rev. 3, 08/2016
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NXP Semiconductors