Datasheet

Board type Symbol Description 256 MAPBGA Unit Notes
— Ψ
JB
Thermal
characterization
parameter, junction
to package top
outside center
(natural
convection)
2.8 °C/W 7
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.,
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
7. Thermal characterization parameter indicating the temperature difference between package bottom center and the
junction temperature per JEDEC JESD51-12. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JB.
Dimensions
6.1 Obtaining package dimensions
Package dimensions are provided in package drawing.
To find a package drawing, go to www.freescale.com and perform a keyword search for
the drawing’s document number:
Package Freescale Document Number
176-pin LQFP 98ASA00673D
256 MAPBGA 98ASA00346D
324 MAPBGA 98ASA10582D
Pinouts
7.1 Package pinouts and signal descriptions
For package pinouts and signal descriptions, refer to the Reference Manual.
6
7
Dimensions
MPC5748G Microcontroller Datasheet Data Sheet, Rev. 2, 05/2014.
Freescale Semiconductor, Inc.
Preliminary
63