Datasheet

Board type Symbol Description 176LQFP Unit Notes
Four-layer (2s2p) R
θJMA
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
16 °C/W 4
— R
θJB
Thermal
resistance, junction
to board
11 °C/W 5
— R
θJCtop
Thermal
resistance, junction
to case top
8 °C/W 6
— R
θJCbotttom
Thermal
resistance, junction
to case bottom
0.5 °C/W 7
— Ψ
JT
Thermal
characterization
parameter, junction
to package top
1 °C/W 8
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance
2. Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Board type Symbol Description 324 MAPBGA Unit Notes
Single-layer (1s) R
θJA
Thermal
resistance, junction
to ambient (natural
convection)
25.5 °C/W 1, 2
Four-layer (2s2p) R
θJA
Thermal
resistance, junction
to ambient (natural
convection)
19.0 °C/W 1,2, 3
Single-layer (1s) R
θJMA
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
18.1 °C/W 13
Four-layer (2s2p) R
θJMA
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
14.8 °C/W 1,3
— R
θJB
Thermal
resistance, junction
to board
10.4 °C/W 4
— R
θJC
Thermal
resistance, junction
to case
8.4 °C/W 5
— Ψ
JT
Thermal
characterization
parameter, junction
to package top
natural convection)
0.45 °C/W 6
Table continues on the next page...
Thermal attributes
MPC5748G Microcontroller Datasheet Data Sheet, Rev. 2, 05/2014.
Freescale Semiconductor, Inc.
Preliminary
61