Datasheet
Table 8. STANDBY Current consumption characteristics
(continued)
Symbol Parameter Conditions
1
Min Typ Max Unit
STANDBY3 STANDBY with
256K RAM
T
a
= 25 °C — 51.3 — µA
T
a
= 125 °C — 5100
1. The content of the Conditions column identifies the components that draw the specific current.
2.7 Electrostatic discharge (ESD) characteristics
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts × (n + 1) supply pin). This
test conforms to the AEC-Q100-002/-003/-011 standard.
NOTE
A device will be defined as a failure if after exposure to ESD
pulses the device no longer meets the device specification
requirements. Complete DC parametric and functional testing
shall be performed per applicable device specification at room
temperature followed by hot temperature, unless specified
otherwise in the device specification.
Table 9. ESD ratings
Symbol Parameter Conditions
1
Class Max value
2
Unit
V
ESD(HBM)
Electrostatic discharge
(Human Body Model)
T
A
= 25 °C
conforming to AEC-
Q100-002
H1C 2000 V
V
ESD(CDM)
Electrostatic discharge
(Charged Device Model)
T
A
= 25 °C
conforming to AEC-
Q100-011
C3A 500
750 (corners)
V
1. All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits.
2. Data based on characterization results, not tested in production.
2.8 Electromagnetic Compatibility (EMC) specifications
EMC measurements to IC-level IEC standards are available from Freescale on request.
General
MPC5748G Microcontroller Datasheet Data Sheet, Rev. 2, 05/2014.
16
Preliminary
Freescale Semiconductor, Inc.