Datasheet

transmitting, FlexRay transmitting, USB-SPH Transmitting, USB-OTG clocked, 2 x I2C transmitting, (2 x I2C clock gated),
1 x SAI transmitting (2 x SAI clock gated), ADC0 converting in continuous mode (ADC1 clock gated), PIT clocked, RTC
clocked, 3 x STM clocked, 2 x DSPI transmitting(Other DSPS clock gated), 2 x SPI transmitting(Other SPIs clock gated), 4
x FlexCAN state machines clocked(other FLEXCAN clock gated), 4 x LINFLEX transmitting (Other clock gated), 1x EMIOS
clocked(used OPWFMB mode) (Others clock gated), FIRC, SIRC, FXOSC, SXOSC, PLL running, BCTU, DMA_CH_MUX,
ACMP clock gated. All others modules clock gated if not specifically mentioned. I/O supply current excluded
6. Recommended Transistors:MJD31@85°C, 105°C and 125°C.
7. Enabled Modules in Body mode enabled at maximum frequency: 2 x e200Z4 @120Mhz(Instruction and Data cache
enabled),Platform@120MHz, SRAMs accessed in parallel, Flash access(prefetch is disabled while buffers are enabled),
HSM reading from flash at regular intervals(500 pll clock cycles), DMA (SRAM to SRAM), ADC0 converting using BCTU
triggers which are triggered through PIT(ADC1 clocked), RTC clocked, 3 x STM clocked, 2 x DSPI transmitting(others
DSPIs clocked), 2 x SPI transmitting(others clocked), 4 x FlexCAN state machines working(others clocked), 9xLINFLEX
transmitting (others clocked), 1xEMIOS operational (used OPWFMB mode) (others clocked), FIRC, SIRC, FXOSC,
SXOSC, PLL running, MEMU, FCCU, SIUL, SDHC,CMP clocked, e200Z2, ENET, MLB, SAI, I2C, FlexRay, USB clock
gated. All others modules clock gated if not specifically mentioned I/O supply current excluded
8. Recommended Transistors:BCP56, BCP68 or MJD31@85°C, BCP56, BCP68 or MJD31@105°C and MJD31@125°C.
9. Enabled Modules in Body mode enabled at maximum frequency:2 x e200Z4 @80Mhz(Instruction and Data cache
enabled),Platform@80MHz, SRAMs accessed in parallel, Flash access(prefetch is disabled while buffers are enabled),
HSM reading from flash at regular intervals(500 pll clock cycles), DMA (SRAM to SRAM), ADC0 converting using BCTU
triggers which are triggered through PIT(ADC1 clocked), RTC clocked, 3 x STM clocked, 2 x DSPI transmitting(others
DSPIs clocked), 2 x SPI transmitting(others clocked), 4 x FlexCAN state machines working(others clocked), 9xLINFLEX
transmitting (others clocked), 1xEMIOS operational (used OPWFMB mode) (others clocked), FIRC, SIRC, FXOSC,
SXOSC, PLL running, MEMU, FCCU, SIUL, SDHC,CMP clocked, e200Z2, ENET, MLB, SAI, I2C, FlexRay, USB clock
gated. All others modules clock gated if not specifically mentioned I/O supply current excluded
10. Recommended Transistors:BCP56, BCP68 or MJD31@85°C, 105°C and 125°C
11. Internal structures hold the input voltage less than V
DD_HV_ADC_REF
+ 1.0 V on all pads powered by V
DDA
supplies, if the
maximum injection current specification is met (3 mA for all pins) and V
DDA
is within the operating voltage specifications.
12. This value is the total current for two ADCs.Each ADC might consume upto 2mA at max.
Table 7. Low Power Unit (LPU) Current consumption characteristics
Symbol Parameter Conditions
1
Min Typ Max Unit
LPU_RUN with 256K RAM,
but only one RAM
being accessed
T
a
= 25 °C
SYS_CLK = 16MHz
ADC0 = OFF, SPI0 = OFF, LIN0 = OFF, CAN0 = OFF
— 10 mA
T
a
= 125 °C
SYS_CLK = 16MHz
ADC0 = ON, SPI0 = ON, LIN0 = ON, CAN0 = ON
— 26
LPU_STOP with 256K RAM T
a
= 25 °C — 0.15 — mA
T
a
= 125 °C — 10.6
1. The content of the Conditions column identifies the components that draw the specific current.
Table 8. STANDBY Current consumption characteristics
Symbol Parameter Conditions
1
Min Typ Max Unit
STANDBY0 STANDBY with
8K RAM
T
a
= 25 °C — 45 — µA
T
a
= 125 °C — 2400
STANDBY1 STANDBY with
64K RAM
T
a
= 25 °C — 46.5 — µA
T
a
= 125 °C — 3000
STANDBY2 STANDBY with
128K RAM
T
a
= 25 °C — 48.1 — µA
T
a
= 125 °C — 3700
Table continues on the next page...
General
MPC5748G Microcontroller Datasheet Data Sheet, Rev. 2, 05/2014.
Freescale Semiconductor, Inc.
Preliminary
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