DISCRETE SEMICONDUCTORS DATA SHEET BTA225 series B Three quadrant triacs high commutation Product specification September 1997
NXP Semiconductors Product specification Three quadrant triacs high commutation GENERAL DESCRIPTION Glass passivated high commutation triacs in a plastic envelope intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur loads. These devices will commutate the full rated rms current at the maximum rated junction temperature, without the aid of a snubber.
NXP Semiconductors Product specification Three quadrant triacs high commutation BTA225 series B THERMAL RESISTANCES SYMBOL PARAMETER Rth j-mb Thermal resistance full cycle junction to mounting base half cycle Thermal resistance in free air junction to ambient Rth j-a CONDITIONS MIN. TYP. MAX. UNIT - 60 1.0 1.4 - K/W K/W K/W MIN. TYP. MAX. UNIT T2+ G+ T2+ GT2- G- 2 2 2 18 21 34 50 50 50 mA mA mA T2+ G+ T2+ GT2- G- 31 34 30 31 1.3 0.7 0.4 0.1 60 90 60 60 1.55 1.5 0.
NXP Semiconductors Product specification Three quadrant triacs high commutation 40 BTA225 series B BTA140 Ptot / W Tmb(max) / C 30 85 = 180 30 1 IT(RMS) / A BTA140 91 C 25 95 120 90 20 60 20 105 30 15 10 115 10 5 0 0 5 10 15 IT(RMS) / A 20 125 30 25 0 -50 BTA225 ITSM / A 50 Tmb / C 100 150 Fig.4. Maximum permissible rms current IT(RMS) , versus mounting base temperature Tmb. Fig.1.
NXP Semiconductors Product specification Three quadrant triacs high commutation 3 IGT(Tj) IGT(25 C) BTA225 series B 80 BTA216 T2+ G+ T2+ GT2- G- 2.5 BTA140 IT / A Tj = 125 C Tj = 25 C 70 typ 60 Vo = 1.073 V max Rs = 0.015 ohms 2 50 40 1.5 30 1 20 0.5 10 0 -50 0 50 Tj / C 100 0 150 Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25˚C), versus junction temperature Tj. 3 IL(Tj) IL(25 C) 0 0.5 1 1.5 VT / V 2 2.5 3 Fig.10. Typical and maximum on-state characteristic.
NXP Semiconductors Product specification Three quadrant triacs high commutation BTA225 series B MECHANICAL DATA Dimensions in mm 4,5 max Net Mass: 2 g 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 0,9 max (3x) 2,54 2,54 0,6 2,4 Fig.13. TO220AB; pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for TO220 envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 6 Rev 1.
NXP Semiconductors Legal information DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
NXP Semiconductors Legal information NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s).
