Datasheet

NXP Semiconductors
BT137S-600D
4Q Triac
BT137S-600D All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 12 June 2014 6 / 13
8. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
half cycle; Fig. 6 - - 2.4 K/WR
th(j-mb)
thermal resistance
from junction to
mounting base
full cycle; Fig. 6 - - 2 K/W
R
th(j-a)
thermal resistance
from junction to
ambient
PCB (FR4) mounted; minimum pad
sizes
- 75 - K/W
003aae698
t
p
(s)
10
-5
1 1010
-1
10
-2
10
-4
10
-3
1
10
-1
10
Z
th(j-mb)
(K/W)
10
-2
bidirectional
unidirectional
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width