Datasheet

NXP Semiconductors
BT137S-600D
4Q Triac
BT137S-600D All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 12 June 2014 10 / 13
10. Package outline
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT428 SC-63
TO-252
sot428_po
06-03-16
14-06-10
Unit
mm
max
nom
min
2.38 0.93 1.1 5.46 0.56 6.22
4.57
0.9
A
Dimensions (mm are the original dimensions)
Note
1. Plastic body may have 45° chamfer.
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped) SOT428
A
1
b
0.89
b
1
b
2
c D
1
D
2
E E
1
e
2.285
e
1
H
D
L
2.95
L
1
0.2
L
2
w
6.47 4.454.0 9.62.22 0.46 0.9 5.00 0.20 5.98 0.50.71 2.55 0.5
6.73 10.4 0.2
y
0 5 10 mm
scale
A
2
1 3
E
1
D
2
D
1
H
D
L
L
1
L
2
e
1
e
mounting
base
w A
b
E
b
2
b
1
c
A
1
y
A
see Note 1
Fig. 12. Package outline DPAK (SOT428)