DISCRETE SEMICONDUCTORS DATA SHEET BT134W series Triacs Product specification September 1997
1;3 Semiconductors Product specification Triacs BT134W series GENERAL DESCRIPTION Glass passivated triacs in a plastic envelope suitable for surface mounting, intended for use in applications requiring high bidirectional transient and blocking voltage capability and high thermal cycling performance. Typical applications include motor control, industrial and domestic lighting, heating and static switching. PINNING - SOT223 PIN QUICK REFERENCE DATA SYMBOL PARAMETER MAX. MAX. MAX.
1;3 SemiconductorV Product specification Triacs BT134W series THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal resistance junction to solder point Thermal resistance junction to ambient Rth j-a MIN. TYP. MAX.
1;3 SemiconductorV Product specification Triacs BT134W series BT134W Ptot / W 1.4 Tsp(max) / C 1.2 104 107 1.2 1 110 120 0.8 90 0.8 113 60 0.6 0.6 116 30 0.4 119 0.2 122 0 0 0.2 0.4 0.6 0.8 IT(RMS) / A 0.4 0.2 125 1.2 1 0 -50 Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where α = conduction angle. 1000 2 50 Tsp / C 100 150 IT(RMS) / A BT134W I TSM IT T 100 0 Fig.4.
1;3 SemiconductorV Product specification Triacs 3 BT134W series IGT(Tj) IGT(25 C) 2 BT136 Tj = 125 C Tj = 25 C T2+ G+ T2+ GT2- GT2- G+ 2.5 2 BT134W IT / A 1.5 Vo = 1.0 V Rs = 0.21 Ohms typ 1 1.5 max 1 0.5 0.5 0 -50 0 50 Tj / C 100 0 150 Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25˚C), versus junction temperature Tj. 3 IL(Tj) IL(25 C) 0 0.5 1 VT / V 1.5 2 Fig.10. Typical and maximum on-state characteristic. 100 TRIAC 2.
1;3 SemiconductorV Product specification Triacs BT134W series MOUNTING INSTRUCTIONS Dimensions in mm. 3.8 min 1.5 min 2.3 1.5 min 6.3 (3x) 1.5 min 4.6 Fig.13. soldering pattern for surface mounting SOT223. PRINTED CIRCUIT BOARD Dimensions in mm. 36 18 60 4.5 4.6 9 10 7 15 50 Fig.14. PCB for thermal resistance and power rating for SOT223. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 μm thick). September 1997 5 Rev 1.
1;3 Semiconductors Product specification Triacs BT134W series MECHANICAL DATA Dimensions in mm 6.7 6.3 Net Mass: 0.11 g B 3.1 2.9 0.32 0.24 0.2 4 A A 0.10 0.02 16 max M 7.3 6.7 3.7 3.3 13 2 1 10 max 1.8 max 1.05 0.80 2.3 0.60 0.85 4.6 3 0.1 M B (4x) Fig.15. SOT223 surface mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0 at 1/8".
NXP Semiconductors Legal information DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1.
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