Datasheet

NXP Semiconductors
BSN20BK
60 V, N-channel Trench MOSFET
BSN20BK All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 18 December 2014 4 / 16
aaa-015759
V
DS
(V)
10
-1
10
2
101
10
-1
10
-2
1
I
D
(A)
10
-3
Limit R
DSon
= V
DS
/I
D
(1)
(2)
(3)
(4)
(5)
(6)
(7)
I
DM
= single pulse
(1) t
p
= 10 µs
(2) t
p
= 100 µs
(3) t
p
= 1 ms
(4) t
p
= 10 ms
(5) DC; T
sp
= 25 °C
(6) t
p
= 100 ms
(7) DC; T
amb
= 25 °C; drain mounting pad 1 cm
2
Fig. 3. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-
source voltage
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
in free air [1] - 351 404 K/W
[2] - 271 311 K/W
R
th(j-a)
thermal resistance
from junction to
ambient
t ≤ 5 s [2] - 210 241 K/W
R
th(j-sp)
thermal resistance
from junction to solder
point
- 65 75 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm
2
.