Datasheet

BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 24 October 2011 6 of 22
NXP Semiconductors
BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm
2
.
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
BCP55
[1]
--192K/W
[2]
--125K/W
[3]
--93K/W
BCX55
[1]
--250K/W
[2]
--132K/W
[3]
--93K/W
BC55PA
[1]
--298K/W
[2]
--151K/W
[3]
--114K/W
[4]
--154K/W
[5]
--76K/W
R
th(j-sp)
thermal resistance from
junction to solder point
BCP55 - - 16 K/W
BCX55 - - 16 K/W
BC55PA --20K/W