Datasheet

BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 8 — 24 October 2011 2 of 22
NXP Semiconductors
BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
2. Pinning information
3. Ordering information
[1] Valid for all available selection groups.
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
SOT223
1base
2 collector
3emitter
4 collector
SOT89
1emitter
2 collector
3base
SOT1061
1base
2emitter
3 collector
132
4
sym016
2, 4
3
1
321
sym042
1
2
3
Transparent top view
12
3
sym021
3
2
1
Table 4. Ordering information
Type number
[1]
Package
Name Description Version
BCP55 SC-73 plastic surface-mounted package with increased
heatsink; 4 leads
SOT223
BCX55 SC-62 plastic surface-mounted package; exposed die pad for
good heat transfer; 3 leads
SOT89
BC55PA HUSON3 plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 2  2  0.65 mm
SOT1061