Datasheet

BCP53_BCX53_BC53PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 9 — 19 October 2011 18 of 22
NXP Semiconductors
BCP53; BCX53; BC53PA
80 V, 1 A PNP medium power transistors
Reflow soldering is the only recommended soldering method.
Fig 26. Reflow soldering footprint SOT1061 (HUSON3)
occupied area
solder paste = solder lands
Dimensions in mm
sot1061_fr
solder resist
0.4
2.1
1.3
0.25
0.25
0.25
1.1 1.2
0.55
0.6
2.3
0.5 (2×)
0.5 (2×) 0.6 (2×)
0.4 (2×)
0.5
1.6
1.7
1.05