Datasheet
BAT46WJ All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 8 November 2011 2 of 12
NXP Semiconductors
BAT46WJ
Single Schottky barrier diode
3. Ordering information
4. Marking
5. Limiting values
[1] T
j
=25C before surge.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
[4] Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 3. Ordering information
Type number Package
Name Description Version
BAT46WJ SC-90 plastic surface-mounted package; 2 leads SOD323F
Table 4. Marking codes
Type number Marking code
BAT46WJ JK
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
R
reverse voltage - 100 V
I
F
forward current - 250 mA
I
FSM
non-repetitive peak
forward current
square wave;
t
p
<10ms
[1]
-2.5A
P
tot
total power dissipation T
amb
25 C
[2][4]
-400mW
[3][4]
-715mW
T
j
junction temperature - 150 C
T
amb
ambient temperature 55 +150 C
T
stg
storage temperature 65 +150 C
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1][3]
- - 310 K/W
[2][3]
- - 175 K/W