Datasheet

BAS16_SER_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 25 August 2008 5 of 20
NXP Semiconductors
BAS16 series
High-speed switching diodes
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB with 60 µm copper strip line.
[3] Single diode loaded.
[4] T
j
=25°C prior to surge.
[5] Reflow soldering is the only recommended soldering method.
[6] Soldering point of cathode tab.
[7] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
[8] Soldering points at pins 4, 5 and 6.
6. Thermal characteristics
Per device
T
j
junction temperature - 150 °C
T
amb
ambient temperature −65 +150 °C
T
stg
storage temperature −65 +150 °C
Table 6. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
BAS16
[1]
- - 500 K/W
BAS16H
[2][3]
- - 330 K/W
[3][4]
- - 150 K/W
BAS16J
[3][4]
- - 230 K/W
BAS16L
[2][3]
- - 500 K/W
BAS16VV
[2][3]
[5]
- - 700 K/W
[3][4]
[5]
- - 410 K/W
BAS16W
[1]
- - 625 K/W
R
th(j-t)
thermal resistance from
junction to tie-point
BAS16 - - 330 K/W
BAS16W - - 300 K/W