Datasheet

BAS16_SER_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 25 August 2008 13 of 20
NXP Semiconductors
BAS16 series
High-speed switching diodes
Reflow soldering is the only recommended soldering method.
Fig 21. Reflow soldering footprint BAS16L (SOD882)
Fig 22. Reflow soldering footprint BAS16T (SOT416/SC-75)
solder lands
solder resist
occupied area
solder paste
sod882_fr
0.9
0.3
(2×)
R0.05 (8×)
0.6
(2×)
0.7
(2×)
0.4
(2×)
1.3
0.7
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
sot416_fr
0.85
1.7
2.2
2
0.5
(3×)
0.6
(3×)
1
1.3
Dimensions in mm