Datasheet

NXP Semiconductors
88W8977
2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4
®
and Bluetooth
®
5 Combo SoC
88W8977 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Product short data sheet Rev. 1 — 13 July 2020
80 / 81
Contents
1 Product overview ................................................ 1
1.1 Applications ........................................................2
1.2 Wi-Fi key features ............................................. 2
1.3 Bluetooth key features .......................................2
1.4 Host interfaces ...................................................3
1.5 Operating characteristics ................................... 3
1.6 General features ................................................ 3
1.7 Internal block diagram ....................................... 4
2 Wi-Fi subsystem ................................................. 5
2.1 IEEE 802.11 standards ......................................5
2.2 Wi-Fi MAC ......................................................... 5
2.3 Wi-Fi baseband ................................................. 6
2.4 Wi-Fi radio ......................................................... 6
2.5 Wi-Fi encryption .................................................7
2.6 Wi-Fi host interfaces ..........................................7
3 Bluetooth subsystem ..........................................8
3.1 Bluetooth ............................................................8
3.2 Bluetooth Low Energy (LE) ............................... 8
3.3 Bluetooth host interfaces ................................... 9
3.4 PCM interface ....................................................9
4 Pin information ..................................................10
4.1 Signal diagram .................................................10
4.2 Pin assignment - 68-pin QFN package option .. 11
4.3 Pad locations - 74-bump eWLP .......................12
4.4 Pin description ................................................. 16
4.4.1 Pin types ..........................................................16
4.4.2 Pin states .........................................................16
4.4.3 General Purpose I/O (GPIO)/LED interface ..... 17
4.4.4 RF front-end control interface ..........................19
4.4.5 Wi-Fi/Bluetooth radio interface ........................ 19
4.4.6 Bluetooth external coexistence interface ......... 20
4.4.7 SDIO host interface ......................................... 21
4.4.8 UART host interface ........................................ 21
4.4.9 LTE external coexistence interface ..................22
4.4.10 PCM interface .................................................. 22
4.4.11 Power management interface ..........................22
4.4.12 Power supply and ground pins ........................ 23
4.4.13 Clock interface ................................................. 23
4.4.14 Power-down pin ............................................... 24
4.4.15 JTAG interface .................................................24
4.5 Configuration pins ............................................25
5 Power information .............................................26
5.1 Leakage optimization .......................................26
5.2 Power-up ..........................................................26
5.2.1 Configuration—PMIC supplies VCORE ........... 27
5.2.2 Configuration—Internal LDO supplies
VCORE ............................................................ 28
5.2.3 Power-up sequence .........................................29
5.3 Power-down ..................................................... 30
5.3.1 Recommended power-down sequence ........... 30
5.3.2 Power-down using PMIC_EN host pin .............31
5.4 Deep sleep ...................................................... 31
6 Absolute maximum ratings .............................. 32
7 Recommended operating conditions .............. 33
8 Electrical specifications ................................... 34
8.1 GPIO/LED interface specifications ...................34
8.1.1 VIO DC characteristics .................................... 34
8.1.1.1 1.8V operation ................................................. 34
8.1.1.2 2.5V operation ................................................. 34
8.1.1.3 3.3V operation ................................................. 34
8.1.2 LED Mode ........................................................35
8.2 RF front-end control interface specifications ....36
8.2.1 VIO_RF DC characteristics ..............................36
8.2.1.1 1.8V operation ................................................. 36
8.2.1.2 3.3V operation ................................................. 36
8.3 Wi-Fi radio specifications .................................37
8.3.1 Wi-Fi radio performance measurement ........... 37
8.3.2 2.4 GHz Wi-Fi receiver performance ............... 38
8.3.3 5 GHz Wi-Fi receiver performance .................. 40
8.3.4 2.4 GHz Wi-Fi transmitter performance ........... 42
8.3.5 5 GHz Wi-Fi transmitter performance .............. 43
8.3.6 Local oscillator .................................................43
8.4 Bluetooth radio specifications .......................... 44
8.4.1 Bluetooth/Bluetooth LE receiver
performance .....................................................45
8.4.2 Bluetooth/Bluetooth LE transmitter
performance .....................................................46
8.5 Current consumption ....................................... 48
8.6 Coexistence specifications .............................. 49
8.7 SDIO host interface specifications ...................50
8.7.1 VIO_SD DC characteristics ............................. 50
8.7.1.1 1.8V operation ................................................. 50
8.7.1.2 3.3V operation ................................................. 50
8.7.2 Default speed mode and high-speed mode ..... 51
8.7.3 SDR12, SDR25, SDR50 modes (up to 100
MHz) (1.8V) ..................................................... 53
8.7.4 DDR50 Mode (50 MHz) (1.8V) ........................ 54
8.8 UART interface specifications ..........................56
8.9 PCM interface specifications ........................... 57
8.10 Clock specifications ......................................... 59
8.10.1 Single-ended clock input modes ......................59
8.10.1.1 2.4 GHz mode ................................................. 59
8.10.1.2 2.4 GHz and 5 GHz dual-band mode .............. 59
8.10.2 Crystal ..............................................................60
8.10.3 Sleep clock ...................................................... 60
8.11 JTAG interface specifications .......................... 61
9 Package information .........................................62
9.1 Package thermal conditions .............................62
9.1.1 QFN package thermal conditions .................... 62
9.1.2 eWLP package thermal conditions .................. 63
9.2 Package mechanical data ............................... 64
9.2.1 68-pin QFN package mechanical drawing ....... 64
9.2.2 74-bump eWLP package mechanical
drawing ............................................................ 65
9.3 Package marking .............................................66
9.3.1 68-pin QFN package marking ..........................66
9.3.2 74-bump eWLP package marking ................... 66
10 Ordering information ........................................ 67
11 Acronyms and abbreviations ...........................68
12 Revision history ................................................ 76
13 Legal information .............................................. 77