Datasheet

NXP Semiconductors
88W8977
2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4
®
and Bluetooth
®
5 Combo SoC
88W8977 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Product short data sheet Rev. 1 — 13 July 2020
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9.1.2 eWLP package thermal conditions
Table 54. Thermal conditions of eWLP package
Symbol Parameter Condition Typ Unit
θ
JA
Thermal resistance
Junction to ambient of package.
θ
JA
= (T
J
- T
A
)/ P
P = total power dissipation
JEDEC 4 in. x 4.5 in.
4-layer PCB
no air flow
44.22 °C/W
ψ
JT
Thermal characteristic parameter
1
Junction to top-center of package.
ψ
JT
= (T
J
- T
TOP
)/P
T
TOP
= temperature on top-center of package
JEDEC 4 in. x 4.5 in.
4-layer PCB
no air flow
0.56 °C/W
ψ
JB
Thermal characteristic parameter
1
Junction to bottom-center of PCB.
ψ
JT
= (T
J
- T
BOTTOM
)/P
T
B
= temperature on bottom-center of package
JEDEC 4 in. x 4.5 in.
4-layer PCB
no air flow
13.93 °C/W