Datasheet

NXP Semiconductors
88W8977
2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4
®
and Bluetooth
®
5 Combo SoC
88W8977 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Product short data sheet Rev. 1 — 13 July 2020
62 / 81
9 Package information
9.1 Package thermal conditions
9.1.1 QFN package thermal conditions
Table 53. Thermal conditions of QFN package
Symbol Parameter Condition Typ Unit
JEDEC 3 in. x 4.5 in.
4-layer PCB
no air flow
28.4 °C/W
JEDEC 3 in. x 4.5 in.
4-layer PCB
1 meter/sec air flow
27.6 °C/W
JEDEC 3 in. x 4.5 in.
4-layer PCB
2 meter/sec air flow
26.1 °C/W
θ
JA
Thermal resistance
Junction to ambient of package.
θ
JA
= (T
J
- T
A
)/ P
P = total power dissipation
JEDEC 3 in. x 4.5 in.
4-layer PCB
3 meter/sec air flow
25.3 °C/W
ψ
JT
Thermal characteristic parameter
1
Junction to top-center of package.
ψ
JT
= (T
J
- T
TOP
)/P
T
TOP
= temperature on top-center of package
JEDEC 3 in. x 4.5 in.
4-layer PCB
no air flow
0.44 °C/W
ψ
JB
Thermal characteristic parameter
1
Junction to bottom surface, center of PCB.
ψ
JT
= (T
J
- T
B
)/P
T
B
= surface temperature of PCB
JEDEC 3 in. x 4.5 in.
4-layer PCB
no air flow
15.4 °C/W
θ
JC
Thermal resistance
1
Junction to case of the package.
θ
JC
= (T
J
- T
C
)/ P
TOP
T
C
= temperature on top-center of package
P
TOP
= power dissipation from top of package
JEDEC 3 in. x 4.5 in.
4-layer PCB
no air flow
13.0 °C/W
θ
JB
Thermal resistance
1
Junction to board of package.
θ
JB
= (T
J
- T
B
)/ P
BOTTOM
P
BOTTOM
= power dissipation from bottom of package to PCB
surface
JEDEC 3 in. x 4.5 in.
4-layer PCB
no air flow
15.6 °C/W