Datasheet

NXP Semiconductors
88W8977
2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4
®
and Bluetooth
®
5 Combo SoC
88W8977 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Product short data sheet Rev. 1 — 13 July 2020
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1.4 Host interfaces
Wi-Fi and Bluetooth host interface options
Wi-Fi Bluetooth
SDIO 3.0 UART
SDIO 3.0 SDIO 3.0
1.5 Operating characteristics
• Supply voltage: 2.2V, 1.8V, and 1.05V
• Operating temperature
– Extended: -30 to 85°C
– Industrial: -40 to 85°C
1.6 General features
• Package options
– 68-pin QFN (8 mm x 8 mm)
– 74-bump eWLP (4.674 mm x 3.46 mm)
• Simultaneous Wi-Fi and Bluetooth operation, including Bluetooth Low Energy (LE)
• Dynamic Rapid Channel Switching (DRCS) for simultaneous operation in 2.4 GHz and
5 GHz bands
• Power saving features
– Efficient power management system
– On-chip LDO for 1.05V generation from 1.8V supply
– Sleep and standby modes
– Deep-sleep mode
• Independent ARM-based Wi-Fi and Bluetooth CPUs
• Independent two-channel Direct Memory Access (DMA)
• Memory:
– Internal SRAM
– Boot ROM
– OTP memory to store the MAC address and calibration data
• Peripheral Interface
– General-Purpose I/O (GPIO) interface