Datasheet

NXP Semiconductors
88W8977
2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4
®
and Bluetooth
®
5 Combo SoC
88W8977 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Product short data sheet Rev. 1 — 13 July 2020
14 / 81
Flip Chip Pad Location Relative to
Die Center (non-bump-side view)
Pin Name
Alpha-Numeric
Designation
X Y
GPIO[13] E8 1400.00 400.0
AVDD18 F1 -1400.0 0.0
AVSS F2 -1000.0 0.0
AVDD18 F3 -600.0 0.0
AVSS F4 -200.0 0.0
UART_LTE_SIN F5 200.0 0.0
GPIO[11] F6 600.0 0.0
GPIO[12] F7 1000.0 0.0
VIO_RF F8 1400.00 0.0
AVSS G3 -600.0 -400.0
RF_CNTL0_N G5 200.0 -400.0
RF_CNTL1_P G6 600.0 -400.0
RF_CNTL2_N G7 1000.0 -400.0
RF_CNTL3_P G8 1400.00 -400.0
AVDD18 H2 -1000.0 -800.0
AVSS H3 -600.0 -800.0
VCORE H4 -200.0 -800.0
AVSS H5 200.0 -800.0
AVSS H6 600.0 -800.0
AVSS H7 1000.0 -800.0
AVDD18 H8 1400.0 -800.0
AVSS J1 -1400.0 -1200.0
AVSS J2 -1000.0 -1200.0
AVSS J3 -600.0 -1200.0
AVSS J4 -200.0 -1200.0
AVSS J6 600.0 -1200.0
AVDD18 J8 1400.0 -1200.0
VPA K3 -600.00 -1600.0
NC L1 -1400.0 -2000.0
RF_TR_5 L2 -1000.0 -2000.0
DNC L3 -600.0 -2000.0
RF_TR_2 L4 -200.0 -2000.0
AVDD18 L5 200.0 -2000.0
AVDD18 L6 600.0 -2000.0