Datasheet

NXP Semiconductors
88W8977
2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4
®
and Bluetooth
®
5 Combo SoC
88W8977 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Product short data sheet Rev. 1 — 13 July 2020
13 / 81
Flip Chip Pad Location Relative to
Die Center (non-bump-side view)
Pin Name
Alpha-Numeric
Designation
X Y
VIO_SD A5 200.0 2000.0
SD_DAT[0] A6 600.0 2000.0
SD_DAT[1] A7 1000.0 2000.0
VSS A8 1400.00 2000.0
GPIO[5] B1 -1400.0 1600.0
GPIO[6] B2 -1000.0 1600.0
GPIO[3] B3 -600.0 1600.0
LDO_VOUT B4 -200.0 1600.0
VCORE B5 200.0 1600.0
SD_CLK B6 600.0 1600.0
SD_DAT[2] B7 1000.0 1600.0
SD_DAT[3] B8 1400.00 1600.0
AVDD18 C1 -1400.0 1200.0
GPIO[7] C2 -1000.0 1200.0
GPIO[4] C3 -600.0 1200.0
GPIO[2] C4 -200.0 1200.0
GPIO[1] C5 200.0 1200.0
SD_CMD C6 600.0 1200.0
SLP_CLK_IN C7 1000.0 1200.0
VSS C8 1400.00 1200.0
AVDD18 D1 -1400.0 800.0
AVSS D2 -1000.0 800.0
PDn D3 -600.0 800.0
GPIO[14] D4 -200.0 800.0
GPIO[15] D5 200.0 800.0
GPIO[8] D6 600.0 800.0
GPIO[0] D7 1000.0 800.0
VIO D8 1400.00 800.0
XTAL_IN E1 -1400.0 400.0
XTAL_OUT E2 -1000.0 400.0
DNC E3 -600.0 400.0
DNC E4 -200.0 400.0
UART_LTE_SOUT E5 200.0 400.0
GPIO[9] E6 600.0 400.0
GPIO[10] E7 1000.0 400.0