Datasheet

NXP Semiconductors
88W8977
2.4 GHz/5 GHz Dual-band 1x1 Wi-Fi 4
®
and Bluetooth
®
5 Combo SoC
88W8977 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved.
Product short data sheet Rev. 1 — 13 July 2020
12 / 81
4.3 Pad locations - 74-bump eWLP
F1
B1
C1
D1
E1
H2
J1
K3
L1
A
B
C
D
E
F
G
H
J
K
L
L5L2 L3 L4 L6 L7 L8
A5A2 A3 A4 A6 A7 A8
F5
C5
D5
E5
G5
H5
F3 F4
C3
D3
E3
C4
D4
E4
G3
H3
J3
H4
J4
F6 F7
C6
D6
E6
C7
D7
E7
G6
H6
G7
H7
1 2 3 4 5 6 7 8
F8
B8
C8
D8
E8
G8
H8
J8
L8
J2 J6
B5B3 B4 B6 B7B2
C2
D2
E2
F2
Non-bump-side view
Figure 5. Pad locations—74-bump WLCSP (Non-bump-side view, bumps down)
[1]
[1] Alphanumeric designations are approximations to the grid.
Table 1. Pad locations—74-bump eWLP
[1]
Flip Chip Pad Location Relative to
Die Center (non-bump-side view)
Pin Name
Alpha-Numeric
Designation
X Y
VIO A2 -1000.0 2000.0
VSS A3 -600.0 2000.0
LDO_VIN A4 -200.0 2000.0