Datasheet

2003 Jul 23 4
Philips Semiconductors Product specification
Hex inverter 74HC04; 74HCT04
handbook, halfpage
114
GND
(1)
1A
V
CC
7
2
3
4
5
6
1Y
2A
2Y
3A
3Y
13
12
11
10
9
6A
6Y
5A
5Y
4A
8
GND
Top view
4Y
MBL760
Fig.2 Pin configuration DHVQFN14.
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
Fig.3 Logic symbol.
handbook, halfpage
MNA342
1A
1Y
1
2
2A
2Y
3
4
3A
3Y
5
6
4A
4Y
9
8
5A
5Y
11
10
6A
6Y
13
12
handbook, halfpage
1
1
2
MNA343
3
1
4
5
1
6
9
1
8
11
1
10
13
1
12
Fig.4 IEC logic symbol. Fig.5 Logic diagram (one inverter).
handbook, halfpage
MNA341
A
Y