Datasheet

Table Of Contents
MC68HC908GP20Rev 2.1 Advance Information
Freescale Semiconductor 401
24.4 44-Pin Plastic Quad Flat Pack (QFP)
-T-
M
Y
E
W
C
-H-
DATUM
PLANE
VIEW P
0.01 (0.004)
44
1
34
33
11
12 22
23
VIEW Y
-N-
-L-
A
S
L-M
M
0.20 (0.008) N
S
H
S
L-M
M
0.20 (0.008) N
S
T
0.05 (0.002)
L-M
S
B
V
-M-
G 40X
PIN 1
IDENT
S
L-M
M
0.20 (0.008) N
S
H
0.05 (0.002)
N
S
L-M
M
0.20 (0.008) N
S
T
S
L-M
M
0.20 (0.008) N
S
T
F
B1
SECTION J1-J1
J
D
BASE METAL
PLATING
44 PL
-L-, -M-, -N-
J1
J1
G
VIEW Y
3 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS -L-, -M- AND -N- TO BE DETERMINED AT
DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -T-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
q1
-H-
DATUM
PLANE
R2R
K
A1
C1
VIEW P
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.90 10.10 0.390 0.398
B 9.90 10.10 0.390 0.398
C 2.00 2.21 0.079 0.087
D 0.30 0.45 0.0118 0.0177
E 2.00 2.10 0.079 0.083
F 0.30 0.40 0.012 0.016
G 0.80 BSC 0.031 BSC
J 0.13 0.23 0.005 0.009
K 0.65 0.95 0.026 0.037
M 5° 10° 5° 10°
S 12.95 13.45 0.510 0.530
V 12.95 13.45 0.510 0.530
W 0.000 0.210 0.000 0.008
Y 5° 10°
5°
10°
A1 0.450 REF
0.170
0.018 REF
0.007B1
C1 1.600 REF 0.063 REF
R1
R2
5° 10° 5° 10°1
2
0.130 0.005
0.130
0.300
0.005
0.012
0.130 0.300 0.005 0.012
q
q 0° 7° 0° 7°
R1R
q2