Datasheet

Table Of Contents
Advance Information MC68HC908GP20Rev 2.1
400 Freescale Semiconductor
24.3 40-Pin Plastic Dual In-Line Package (DIP)
1 20
40 21
B
A
C
SEATING
PLANE
DFGH
K
N
M
J
L
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 51.69 52.45 2.035 2.065
B 13.72 14.22 0.540 0.560
C 3.94 5.08 0.155 0.200
D 0.36 0.56 0.014 0.022
F 1.02 1.52 0.040 0.060
G
2.54 BSC 0.100 BSC
H 1.65 2.16 0.065 0.085
J 0.20 0.38 0.008 0.015
K 2.92 3.43 0.115 0.135
L
15.24 BSC 0.600 BSC
M
1°
N 0.51 1.02 0.020 0.040
NOTES:
1. POSITION TOLERANCE OF LEADS (D), SHALL
BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITIONS, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1°0°0°