Datasheet

2N7002 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 7 — 8 September 2011 4 of 13
NXP Semiconductors
2N7002
60 V, 300 mA N-channel Trench MOSFET
6. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance
from junction to
ambient
Mounted on a printed-circuit board;
minimum footprint ; vertical in still air
- - 350 K/W
R
th(j-sp)
thermal resistance
from junction to solder
point
see Figure 4 - - 150 K/W
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration
003aab351
1
10
10
2
10
3
10
-5
10
-4
10
-3
10
-2
10
-1
1 10
t
p
(s)
Z
th(j-sp)
(K/W)
single pulse
0.2
0.1
0.05
δ =
0.5
0.02
t
p
T
P
t
t
p
T
δ =