Datasheet

Analog Integrated Circuit Device Data
6 Freescale Semiconductor
07XSC200
THERMAL RATINGS
Operating Temperature
• Ambient
• Junction
(5)
T
A
T
J
- 40 to 125
- 40 to 150
C
Storage Temperature
T
STG
- 55 to 150 C
THERMAL RESISTANCE
Thermal Resistance
• Junction to Case
• Junction to Ambient
(6)
R
JC
R
JA
4.0
35
C/ W
Peak Pin Reflow Temperature During Solder Mounting
(7)
T
SOLDER
260 C
Notes
5. To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not
exceed 125
C.
6. Device mounted on a 2s2p test board per JEDEC JESD51-2. 20 °C/W of R
θJA
can be reached in a real application case (4 layers board).
7. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings Symbol Value Unit