Datasheet

Analog Integrated Circuit Device Data
Freescale Semiconductor 5
07XSC200
3 Electrical Characteristics
3.1 Maximum Ratings
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Ratings Symbol Value Unit
ELECTRICAL RATINGS
V
PWR
Supply Voltage Range
• Load Dump at 25 °C (400 ms)
• Maximum Operating Voltage
• Reverse Battery
V
PWR(SS)
41
28
-18
V
V
DD
Supply Voltage Range
V
DD
-0.3 to 5.5 V
Input / Output Voltage
(4)
-0.3 to V
DD
+ 0.3 V
WAKE Input Clamp Current
I
CL(WAKE)
2.5 mA
CSNS Input Clamp Current
I
CL(CSNS)
2.5 mA
HS [0:1] Voltage
•Positive
• Negative
V
HS[0:1]
41
-24
V
Output Current per Channel
• Nominal Continuous Current
(1)
• Short-circuit Transient Current
• Reverse Continuous Current
(1)
I
HS[0:1]
26
116
-26
A
High Side Breakdown Voltage
V
PWR
- V
HS
47 V
HS[0,1] Output Clamp Energy using single pulse method
(2)
E
CL [0:1]
100 mJ
ESD Voltage
(3)
• Human Body Model (HBM) for HS[0:1], VPWR and GND
• Human Body Model (HBM) for other pins
• Charge Device Model (CDM)
Corner Pins (1, 27, 28, 57)
All Other Pins
V
ESD1
V
ESD2
V
ESD3
V
ESD4
± 8000
± 2000
± 750
± 500
V
Notes
1. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using board thermal resistance is required.
2. Active clamp energy using single-pulse method (L = 2.0 mH, R
L
= 0 , V
PWR
= 14 V, T
J
= 150 C initial).
3. ESD testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100 pF, R
ZAP
= 1500 ), the Machine Model (MM)
(C
ZAP
= 200 pF, R
ZAP
= 0 ), and the Charge Device Model (CDM), Robotic (C
ZAP
= 4.0 pF).
4. Input / Output pins are: IN[0:1], CLOCK, RSTB, FSI, CSNS, SI, SCLK, CSB, SO, FSB