Datasheet

Analog Integrated Circuit Device Data
46 Freescale Semiconductor
07XSC200
7 Packaging
7.1 Soldering Information
The 07XSC200 is packaged in a surface mount power package intended to be soldered directly on the printed circuit board.
The 07XSC200 was qualified in accordance with JEDEC standards J-STD-020C Pb-Free reflow profile. The maximum peak
temperature during the soldering process should not exceed 260 °C for 40 seconds maximum duration.