Datasheet

Analog Integrated Circuit Device Data
Freescale Semiconductor 9
10XSC425
4 Electrical Characteristics
4.1 Maximum Ratings
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Symbol Ratings Value Unit Notes
ELECTRICAL RATINGS
V
PWR(SS)
VPWR Supply Voltage Range
• Load Dump at 25 °C (400 ms)
• Maximum Operating Voltage
• Reverse Battery
41
28
-18
V
V
DD
VDD Supply Voltage Range
-0.3 to 5.5 V
V
DIG
Input / Output Voltage
-0.3 to 5.5 V
(5)
V
SO
SO and CSNS Output Voltage
-0.3 to V
DD
+ 0.3 V
I
DIG
Digital Input/ Output Current in Clamp Mode
100 µA
I
CL(WAKE)
WAKE Input Clamp Current
2.5 mA
I
CL(CSNS)
CSNS Input Clamp Current
2.5 mA
V
HS[0:3]
HS [0:3] Voltage
• Positive
• Negative
41
-24
V
V
PWR
- V
HS
High Side Breakdown Voltage
47 V
I
HS[0:3]
Output Current
6.0 A
(2)
E
CL [0:1]
HS[0,1] Output Clamp Energy using single pulse method
60 mJ
(3)
E
CL [2:3]
HS[2,3] Output Clamp Energy using single pulse method
25 mJ
(3)
V
ESD1
V
ESD2
V
ESD3
V
ESD4
ESD Voltage (V
PWR
Pins 9 and 33 must be externally connected.)
• Human Body Model (HBM) for HS[0:3], VPWR and GND
• Human Body Model (HBM) for other pins
• Charge Device Model (CDM)
Corner Pins (1, 13, 19, 21)
All Other Pins (2-12, 14-18, 20, 22-24)
± 8000
± 2000
± 750
± 500
V
(4)
Notes
2. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using package thermal resistance is required.
3. Active clamp energy using single-pulse method (L = 2.0 mH, R
L
= 0 , V
PWR
= 14 V, T
J
= 150 C initial).
4. Pins 9 and 33 must be externally connected. ESD testing is performed in accordance with the Human Body Model (HBM)
(C
ZAP
= 100 pF, R
ZAP
= 1500 ), the Machine Model (MM) (C
ZAP
= 200 pF, R
ZAP
= 0 ), and the Charge Device Model (CDM), Robotic
(C
ZAP
= 4.0 pF).
5. Input / Output pins are: IN[0:3], RSTB, FSI, SI, SCLK, CSB, and FSB