Datasheet

Analog Integrated Circuit Device Data
Freescale Semiconductor 51
10XSC425
8 Packaging
8.1 Soldering Information
The 10XSC425 was qualified in accordance with JEDEC standards J-STD-020C Pb-free reflow profile. The maximum peak
temperature during the soldering process should not exceed 260
°C for 40 seconds maximum duration.
8.2 Marking Information
The device is identified by the part number: 10XSC425.
Device markings indicate build information containing the week and year of manufacture. The date is coded with the last four
characters of the nine character build information code (e.g. “CTKAH0929”). The date is coded as four numerical digits where
the first two digits indicate the year and the last two digits indicate the week. For instance, the date code “1329” indicates the 29
th
week of the year 2013.
8.3 Package Mechanical Dimensions
Package dimensions are provided in package drawings. To find the most current package outline drawing, go to
www.freescale.com and perform a keyword search for the drawing’s document number.
Table 25. Package Outline
Package Suffix Package Outline Drawing Number
32-Pin SOIC-EP EK 98ASA00368D