Datasheet
TJA1085 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 23 October 2012 34 of 61
NXP Semiconductors
TJA1085
FlexRay active star coupler
[1] According to ISO7637, test pulse 1, class C; verified by an external test house.
[2] According to ISO7637, test pulse 2a, class C; verified by an external test house.
[3] According to ISO7637, test pulse 3a, class C; verified by an external test house.
[4] According to ISO7637, test pulse 3b, class C; verified by an external test house.
[5] In accordance with IEC 60747-1. An alternative definition of T
vj
is: T
vj
=T
amb
+P R
th(j-a)
, where R
th(j-a)
is a fixed value used in the
calculation of T
vj
. The rating for T
vj
limits the allowable combinations of power dissipation (P) and ambient temperature (T
amb
).
[6] IEC61000-4-2: C = 150 pF; R = 330 ; verified by an external test house. The test result is equal to or better than 6 kV (unaided).
[7] HBM: with respect to GND (and to each other); C = 100 pF; R = 1.5 k;
[8] MM: C = 200 pF; L = 0.75 H; R = 10 .
[9] CDM: R = 1 .
[10] With 3.3 k in series.
[11] With 100 nF from V
BAT
to GND.
[12] Guaranteed only when all n.c. pins are connected to GND.
8. Thermal characteristics
[1] TJA1085 mounted on a JEDEC 2s2p board with 36 vias between layer 1 and layer 2; via diameter: 0.5 mm, wall thickness: 18 m.
V
ESD
electrostatic discharge voltage IEC61000-4-2 on pins BP and BM to
GND
[6]
6.0 +6.0 kV
IEC61000-4-2 on pin LWU to GND
[6][10]
6.0 +6.0 kV
IEC61000-4-2 on pin V
BAT
to GND
[6][11]
6.0 +6.0 kV
HBM on pins BP and BM to GND
[7]
8.0 +8.0 kV
HBM on pins LWU and V
BAT
to GND
[7][12]
6.0 +6.0 kV
HBM on any other pin
[7]
4.0 +4.0 kV
MM on all pins
[8]
200 +200 kV
CDM on all pins
[9]
1000 +1000 kV
Table 12. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter Conditions Min Max Unit
Table 13. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-a)
thermal resistance from junction to ambient
[1]
in free air 24 K/W
R
th(j-c)
thermal resistance from junction to case in free air 2.5 K/W