Datasheet

TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 18 of 22
NXP Semiconductors
TJA1051
High-speed CAN transceiver
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering of HVSON packages
Section 16 contains a brief introduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can found in the following application notes:
• AN10365 ‘Surface mount reflow soldering description”
• AN10366 “HVQFN application information”
MSL: Moisture Sensitivity Level
Fig 10. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature