Datasheet

TDA8034T_TDA8034AT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 3.1 — 13 December 2012 24 of 30
NXP Semiconductors
TDA8034T; TDA8034AT
Smart card interface
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
MSL: Moisture Sensitivity Level
Fig 16. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 12. Abbreviations
Acronym Description
EMV Europay MasterCard VISA
ESD ElectroStatic Discharge
ESR Equivalent Series Resistor
FCDM Field Charged Device Model
HBM Human Body Model
LDO Low Drop-Out
MM Machine Model
NMOS Negative-channel Metal-Oxide Semiconductor
POR Power-On Reset