Datasheet

TDA8034T_TDA8034AT All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 3.1 — 13 December 2012 2 of 30
NXP Semiconductors
TDA8034T; TDA8034AT
Smart card interface
 Identification
 Bank card readers
4. Quick reference data
[1] To meet these specifications, V
CC
should be decoupled to pin GND using two ceramic multilayer capacitors of low ESR with values of
either 100 nF or one 220 nF and one 470 nF.
5. Ordering information
Table 1. Quick reference data
V
DDP
=5V; V
DD
=3.3V; V
DD(INTF)
=3.3V; f
xtal
=10MHz; GND=0V; T
amb
= 25 °C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supply
V
DDP
power supply voltage pin V
DDP
4.85 5 5.5 V
V
DD
supply voltage pin V
DD
2.7 3.3 3.6 V
V
DD(INTF)
interface supply voltage pin V
DD(INTF)
1.6 3.3 V
DD
+0.3 V
I
DD
supply current Shutdown mode - - 35 A
I
DDP
power supply current Shutdown mode; f
xtal
stopped
--5 A
Active mode;
f
CLK
=
1
⁄
2
f
xtal
; no load
--1.5mA
I
DD(INTF)
interface supply current Shutdown mode - - 6 A
Card supply voltage: pin V
CC
[1]
V
CC
supply voltage active mode
5V card
I
CC
< 65 mA DC 4.75 5.0 5.25 V
current pulses of
40 nA/s at
I
CC
<200mA;
t < 400 ns
4.65 5.0 5.25 V
V
ripple(p-p)
peak-to-peak ripple voltage from 20 kHz to 200 MHz - - 350 mV
I
CC
supply current V
CC
= 0 V to 5 V or 3 V - - 65 mA
General
t
deact
deactivation time see Figure 7 on page 11 35 90 250 s
P
tot
total power dissipation T
amb
= 25 C to +85 C- - 0.25W
T
amb
ambient temperature 25 - +85 C
Table 2. Ordering information
Type number Package
Name Description Version
TDA8034T/C1 SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
TDA8034AT/C1