TDA8034T; TDA8034AT Smart card interface Rev. 3.1 — 13 December 2012 Product data sheet 1. General description The TDA8034T/TDA8034AT is a cost-effective analog interface for asynchronous and synchronous smart cards operating at 5 V or 3 V. Using few external components, the TDA8034T/TDA8034AT provides all supply, protection and control functions between a smart card and the microcontroller. 2.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface Identification Bank card readers 4. Quick reference data Table 1. Quick reference data VDDP = 5 V; VDD = 3.3 V; VDD(INTF) = 3.3 V; fxtal = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VDDP power supply voltage pin VDDP 4.85 5 5.5 V VDD supply voltage pin VDD 2.7 3.3 3.6 V VDD(INTF) interface supply voltage pin VDD(INTF) 1.6 3.3 VDD + 0.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 6. Block diagram 10 μF 100 nF VDD 14 100 nF GND VDDP 9 13 SUPPLY INTERNAL REFERENCE VOLTAGE SENSE PRESN RSTIN CMDVCCN OFFN CLKDIV1 INTERNAL OSCILLATOR CLKUP ALARMN EN1 PVCC 7 4 SEQUENCER 5 15 6 LEVEL SHIFTER EN4 EN3 CLOCK CIRCUITRY EN2 CLK VCC LDO 12 VCC 470 nF RESET GENERATOR 11 RST CLOCK GENERATOR 10 CLK CARD CONNECTOR CMDVCCN DETECTION THERMAL PROTECTION I/OUC 16 CRYSTAL OSCILLATOR 3 VDD(INTF) 100 nF Fig 1.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 7. Pinning information 7.1 Pinning XTAL1 1 16 I/OUC XTAL2 2 15 OFFN VDD(INTF) 3 14 VDD RSTIN 4 CMDVCCN 5 CLKDIV1 6 11 RST PRESN 7 10 CLK I/O 8 TDA8034T 13 VDDP TDA8034AT TDA8034BT 12 VCC 9 GND 001aak990 Fig 2. Pin configuration (SO16) 7.2 Pin description Table 3.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface [5] Uses an internal 20 k pull-up resistor connected to pin VDD(INTF). [6] Uses an internal 10 k pull-up resistor connected to pin VDD(INTF). 8. Functional description Remark: Throughout this document the ISO 7816 terminology conventions have been adhered to and it is assumed that the reader is familiar with these. 8.1 Power supplies The power supply voltage ranges are as follows: • VDDP: 4.85 V to 5.5 V • VDD: 2.7 V to 3.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 8.2 Voltage supervisor VDD(INTF) VDD VDD REFERENCE VOLTAGE VDDP 5 V or 3 V 001aak991 Fig 3. Voltage supervisor circuit The voltage supervisor monitors the voltage of the VDDP and VDD supplies providing both Power-On Reset (POR) and supply drop-out detection during a card session. The supervisor threshold voltages for VDDP and VDD are set internally.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 8.3 Clock circuits The clock signal from pin CLK to the card is either supplied by an external clock signal connected to pin XTAL1 or generated using a crystal connected between pins XTAL1 and XTAL2. The TDA8034T/TDA8034AT automatically detects if an external clock is connected to XTAL1, eliminating the need for a separate pin to select the clock source.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 8.4 Input and output circuits When pins I/O and I/OUC are pulled HIGH using an 11 k resistor between pins I/O and VCC and/or between pins I/OUC and VDD(INTF), both lines enter the idle state. Pin I/O is referenced to VCC and pin I/OUC to VDD(INTF), thus allowing operation at VCC VDD(INTF). The first side on which a falling edge occurs becomes the master.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 8.5 Shutdown mode After a power-on reset, if pin CMDVCCN is HIGH, the circuit enters the Shutdown mode, ensuring only the minimum number of circuits are active while the TDA8034T/TDA8034AT waits for the microcontroller to start a session. • all card contacts are inactive. The impedance between the contacts and GND is approximately 200 .
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface CMDVCCN XTAL VCC I/O ATR CLK > 200 ns RSTIN RST I/OUC OSCINT low frequency t1 = t2 t0 high frequency t4 td(start) td(end) = tact 001aai966 OSCINT = internal oscillator. Fig 6. Activation sequence at t3 8.7 Deactivation sequence When a session ends, the microcontroller sets pin CMDVCCN HIGH.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface Remark: The value of period T is 64 times the period interval of the internal oscillator (i.e. 25 s). CMDVCC RST CLK I/O VCC XTAL1 low frequency high frequency OSCINT t10 t11 t12 t13 t14 tdeact 001aak995 OSCINT = internal oscillator. Fig 7. Deactivation sequence 8.8 VCC regulator The VCC buffer is able to continuously deliver up to 65 mA at VCC = 5 V or 3 V.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface • In card sessions, pin CMDVCCN is LOW: when pin OFFN goes LOW, the fault detection circuit triggers the automatic emergency deactivation sequence (see Figure 8). When the microcontroller resets pin CMDVCCN to HIGH, after the deactivation sequence, pin OFFN is rechecked. If the card is still present, pin OFFN returns to HIGH. This check identifies the fault as either a hardware problem or a card removal incident.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface PRESN OFFN CMDVCCN tdeb tdeb (1) VCC (2) 001aal411 (1) Deactivation caused by card withdrawal. (2) Deactivation caused by short-circuit. Fig 9. Operation of debounce feature with pins OFFN, CMDVCCN, PRESN and VCC 8.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface CMDVCCN t0 t1 t2 3 V or 5 V 3V VCC 001aal000 Fig 12. Card activation, VCC = 3 V, t0 > 15 ms If pin CMDVCCN is HIGH for more than 30 ms (card inactive), and if the card needs to be activated at 3 V, the sequence shown in Figure 12 applies: pin CMDVCCN must be set LOW for t1 (200 s < t1 < 700 s), and then HIGH for t2 (200 s < t2 < 15 ms) before going LOW. 9.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 11. Characteristics Table 7. Characteristics of IC supply voltage VDDP = 5 V; VDD = 3.3 V; VDD(INTF) = 3.3 V; fxtal = 10 MHz; GND = 0 V; Tamb = 25 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supply VDDP power supply voltage pin VDDP 4.85 5 5.5 V VDD supply voltage pin VDD 2.7 3.3 3.6 V VDD(INTF) interface supply voltage pin VDD(INTF) 1.6 3.3 VDD + 0.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface Table 7. Characteristics of IC supply voltage …continued VDDP = 5 V; VDD = 3.3 V; VDD(INTF) = 3.3 V; fxtal = 10 MHz; GND = 0 V; Tamb = 25 C; unless otherwise specified.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface Table 7. Characteristics of IC supply voltage …continued VDDP = 5 V; VDD = 3.3 V; VDD(INTF) = 3.3 V; fxtal = 10 MHz; GND = 0 V; Tamb = 25 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tf(o) output fall time CL 80 pF; 10 % to 90 %; 0 V to VCC - - 0.1 s Rpu pull-up resistance connected to VCC 7 9 11 k Ipu pull-up current VOH = 0.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface Table 7. Characteristics of IC supply voltage …continued VDDP = 5 V; VDD = 3.3 V; VDD(INTF) = 3.3 V; fxtal = 10 MHz; GND = 0 V; Tamb = 25 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VOH HIGH-level output voltage IOH = 200 A 0.9VCC - VCC V current limit IOH = 20 mA 0 - 0.4 V tr rise time CL = 100 pF - - 0.1 s tf fall time CL = 100 pF - - 0.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface Table 7. Characteristics of IC supply voltage …continued VDDP = 5 V; VDD = 3.3 V; VDD(INTF) = 3.3 V; fxtal = 10 MHz; GND = 0 V; Tamb = 25 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tw pulse width 5 V card; Figure 10 30 - - ms 3 V card; Figure 11, Figure 12 - - 15 ms Card detection input[6][7] VIL LOW-level input voltage 0.3 - 0.3VDD(INTF) V VIH HIGH-level input voltage 0.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface Table 9. Timing characteristics …continued Symbol Parameter Conditions td delay time CLK sent to card using an external clock tdeb debounce time Min Typ Max Unit td(start) = t3; see Figure 6 on page 10 2090 - 4112 s td(end) = t5; see Figure 6 on page 10 2120 - 4160 s 3.2 4.5 6.4 ms pin PRESN tr tf 90 % VOH 90 % (VOH + VOL) / 2 10 % 10 % VOL t1 t2 001aai973 Fig 13.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 13. Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 14.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 15. Abbreviations Table 12.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 16. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA8034T_TDA8034AT v.3.1 20121213 Product data sheet - Modifications: TDA8034T_TDA8034AT v.3.0 Modifications: TDA8034T_TDA8034AT v.2.0 Modifications: TDA8034T_TDA8034AT_1 TDA8034T_TDA8034AT Product data sheet • TDA8034T_TDA8034AT v.3.0 Section 8.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 19. Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Quick reference data . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . .2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4 Clock configuration . . . . . . . . . . . . . . . . . . . . . .7 Limiting values . . . . . . . . . . . . . . . . . . .
TDA8034T; TDA8034AT NXP Semiconductors Smart card interface 20. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. Fig 15. Fig 16. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Pin configuration (SO16) . . . . . . . . . . . . . . . . . . . .4 Voltage supervisor circuit . . . . . . . . . . . . . . . . . . . .6 Voltage supervisor waveforms . . . . . . . . . . . . . . . .6 Basic layout for using an external clock. . . . .
NXP Semiconductors TDA8034T; TDA8034AT Smart card interface 21. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 17 17.1 17.2 17.3 17.4 18 19 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . .