Datasheet
TDA8034HN All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3.2 — 25 March 2014 3 of 30
NXP Semiconductors
TDA8034HN
Low power smart card interface
[1] To meet these specifications, V
CC
should be decoupled to pin GND using two ceramic multilayer capacitors of low ESR with values of
either 100 nF or one 220 nF and one 470 nF.
5. Ordering information
6. Block diagram
Table 2. Ordering information
Type number Package
Name Description Version
TDA8034HN/C1 HVQFN24 plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 4 0.85 mm
SOT616-1
ALARMN, CLKUP, EN1, PVCC, EN4, EN3, EN2 and CLK are internal signals.
(1) Optional external resistor bridge, if not required connect pin PORADJ to V
DD(INTF)
Fig 1. Block diagram
001aal136
100 nF
100 nF
100 nF
470 nF
220 nF
10 μF
INTERNAL
OSCILLATOR
THERMAL
PROTECTION
CRYSTAL
OSCILLATOR
RESET
GENERATOR
V
CC
LDO
CLOCK
GENERATOR
I/O
TRANSCEIVER
I/O
TRANSCEIVER
I/O
TRANSCEIVER
CLOCK
CIRCUIT
LEVEL
SHIFTER
C5
CARD
CONNECTOR
C1
C6 C2
C7 C3
C8 C4
SEQUENCER
SUPPLY
INTERNAL
REFERENCE
VOLTAGE
SENSE
12
GND
EN1
ALARMN
PRESN
8
PORADJ 18
RSTIN
3
CMDVCCN
5
OFFN
19
CLKDIV1
6
CLKDIV2
7
VCC_SEL2
2
VCC_SEL1
4
I/OUC
20
21
22
CLKUP
EN4
12423
XTAL2
AUX2UC
AUX1UC
XTAL1
V
DD(INTF)
EN3
EN2
CLK
PVCC
I/O
9
CLK
13
RST
14
V
CC
15
AUX1
10
AUX2
11
17
V
DD
16
V
DDP
R2
R1
V
DD(INTF)
(1)
TDA8034HN