Datasheet

TDA8034HN All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3.2 — 25 March 2014 14 of 30
NXP Semiconductors
TDA8034HN
Low power smart card interface
10. Thermal characteristics
11. Characteristics
Table 6. Thermal characteristics
Symbol Package name Parameter Conditions Typ Unit
R
th(j-a)
HVQFN24 thermal resistance from junction to ambient in free air 53 K/W
Table 7. Characteristics of IC supply voltage
V
DDP
= 5 V; V
DD
= 3.3 V; V
DD(INTF)
= 3.3 V; f
xtal
= 10 MHz; GND = 0 V; T
amb
= 25  C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supply
V
DDP
power supply voltage pin V
DDP
V
CC
= 5 V 4.85 5 5.5 V
V
CC
= 3V or 1.8V 3 3.3 5.5 V
V
DD
supply voltage pin V
DD
2.7 3.3 3.6 V
V
DD(INTF)
interface supply voltage pin V
DD(INTF)
1.6 3.3 V
DD
+0.3 V
I
DD
supply current shutdown mode - - 35 A
deep shutdown mode - - 12 A
active mode - - 2 mA
I
DDP
power supply current shutdown mode
f
xtal
stopped - - 5 A
active mode
f
CLK
=
1
⁄
2
f
xtal
; no load - - 1.5 mA
f
CLK
=
1
⁄
2
f
xtal
; I
CC
=65mA - - 70 mA
I
DD(INTF)
interface supply current shutdown mode - - 6 A
active mode - - 2 mA
V
th
threshold voltage no external resistors on pin
PORADJ
pin V
DD
falling 2.30 2.40 2.50 V
pin V
DDP
falling;
V
CC
=5V
3.00 4.10 4.40 V
external resistors on pin
PORADJ
1.20 1.24 1.29 V
V
hys
hysteresis voltage no external resistors on pin
PORADJ
pin V
DD
50 100 150 mV
pin V
DDP
; V
CC
= 5 V 100 200 350 mV
t
w
pulse width 5.1 8 10.2 ms
I
L
leakage current pin PORADJ < 0.5 V 0.1 +4 +10 A
pin PORADJ > 1 V 1- +1 A
Card supply voltage: pin V
CC
[1]
C
dec
decoupling capacitance connected to V
CC
[2]
550 - 830 nF