Datasheet

TDA8025_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 6 April 2009 36 of 38
NXP Semiconductors
TDA8025
IC card interface
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
15. Abbreviations
16. Revision history
MSL: Moisture Sensitivity Level
Fig 20. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 13. Abbreviations
Acronym Description
ATR Answer To Request
ESD ElectroStatic Discharge
ESR Equivalent Series Resistance
NMOS Negative-channel Metal-Oxide Semiconductor
POR Power-On Reset
PMOS Positive-channel Metal-Oxide Semiconductor
Table 14. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TDA8025_1 20090406 Product data sheet - -