Datasheet
TDA8025_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 6 April 2009 33 of 38
NXP Semiconductors
TDA8025
IC card interface
13. Package outline
Fig 19. Package outline SOT617-1
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
5.1
4.9
D
h
3.25
2.95
y
1
5.1
4.9
3.25
2.95
e
1
3.5
e
2
3.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT617-1 MO-220- - - - - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT617-1
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
916
32
25
24
17
8
1
X
D
E
C
B
A
e
2
terminal 1
index area
terminal 1
index area
01-08-08
02-10-18
1/2 e
1/2 e
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)