Datasheet

2004 July 12 25
Philips Semiconductors Product specification
IC card interface TDA8024
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.8
0.5
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT361-1 MO-153
99-12-27
03-02-19
0.25
w M
b
p
Z
e
114
28
15
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
A
max.
1.1