Datasheet

2004 July 12 24
Philips Semiconductors Product specification
IC card interface TDA8024
14 PACKAGE OUTLINES
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
Q
Z
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
18.1
17.7
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT136-1
X
14
28
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
c
L
v M
A
e
15
1
(A )
3
A
y
0.25
075E06 MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.71
0.69
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0 5 10 mm
scale
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
99-12-27
03-02-19