Datasheet

2004 July 12 23
Philips Semiconductors Product specification
IC card interface TDA8024
handbook, full pagewidth
100 nF
(1)
100 nF
(1)
100 nF
(3)
(6)
(7)
AUX2UC
AUX1UC
I/OUC
XTAL2
XTAL1
OFF
GND
V
DD
RSTIN
CMDVCC
PORADJ
V
CC
RST
CLK
CLKDIV1
CLKDIV2
5V/3V
PGND
V
DDP
S1
S2
V
UP
PRES
PRES
I/O
AUX2
AUX1
CGND
28
27
26
25
24
23
22
21
20
19
18
17
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15
TDA8024
C5
C6
C7
C8
C1
C2
C3
C4
CARD READ
(normally closed type)
K1
K2
+3.3 V
+3.3 V
V
DD
58.1 kΩ
41.9 kΩ
3.3 V POWERED
MICROCONTROLLER
33 pF
100 nF
100 nF
(4)
220 nF
(5)
+5 V
10 µF
100 kΩ
MDB050
+3.3 V
(2)
Fig.13 Application diagram.
(1) These capacitors must be of the low ESR-type and be placed near the IC (within 100 mm).
(2) TDA8024 and the microcontroller must use the same V
DD
supply.
(3) Make short, straight connections between CGND, C5 and the ground connection to the capacitor.
(4) Mount one low ESR-type 100 nF capacitor close to pin V
CC
.
(5) Mount one low ESR-type 100 or 220 nF capacitor close to C1 contact (less than 100 mm from it).
(6) The connection to C3 should be routed as far from C2, C7, C4 and C8 and, if possible, surrounded by grounded tracks.
(7) Optional resistor bridge for changing the threshold of V
DD
. If this bridge is not required pin 18 should be connected to ground; see Section 8.2.2.
Pin 18 is not connected in the TDA8024AT.