Datasheet
2004 July 12 2
Philips Semiconductors Product speciļ¬cation
IC card interface TDA8024
CONTENTS
1 FEATURES
2 APPLICATIONS
3 GENERAL DESCRIPTION
4 ORDERING INFORMATION
5 QUICK REFERENCE DATA
6 BLOCK DIAGRAM
7 PINNING
8 FUNCTIONAL DESCRIPTION
8.1 Power supply
8.2 Voltage supervisor
8.2.1 Without external divider on pin PORADJ
(or with TDA8024AT)
8.2.2 With an external divider on pin PORADJ (not
for the TDA8024AT)
8.2.3 Application examples
8.3 Clock circuitry
8.4 I/O transceivers
8.5 Inactive mode
8.6 Activation sequence
8.7 Active mode
8.8 Deactivation sequence
8.9 V
CC
generator
8.10 Fault detection
9 LIMITING VALUES
10 HANDLING
11 THERMAL CHARACTERISTICS
12 CHARACTERISTICS
13 APPLICATION INFORMATION
14 PACKAGE OUTLINES
15 SOLDERING
15.1 Introduction to soldering surface mount
packages
15.2 Reflow soldering
15.3 Wave soldering
15.4 Manual soldering
15.5 Suitability of surface mount IC packages for
wave and reflow soldering methods
16 DATA SHEET STATUS
17 DEFINITIONS
18 DISCLAIMERS
