Datasheet

2004 July 12 19
Philips Semiconductors Product specification
IC card interface TDA8024
Crystal oscillator (pins XTAL1 and XTAL2)
C
XTAL1
,
C
XTAL2
external capacitance on
pins XTAL1 and XTAL2
depends on type of crystal or
resonator used
−−15 pF
f
XTAL
crystal frequency 2 − 26 MHz
f
XTAL1
frequency applied on
pin XTAL1
0 − 26 MHz
V
IL
LOW-level input voltage on
pin XTAL1
−0.3 − +0.3V
DD
V
V
IH
HIGH-level input voltage
on pin XTAL1
0.7V
DD
− V
DD
+ 0.3 V
Data lines (pins I/O, I/OUC, AUX1, AUX2, AUX1UC and AUX2UC)
t
d(I/O-I/OUC),
t
d(I/OUC-I/O)
I/O to I/OUC, I/OUC to I/O
falling edge delay
−−200 ns
t
pu
active pull-up pulse width −−100 ns
f
I/O(max)
maximum frequency on
data lines
−−1 MHz
C
i
input capacitance on data
lines
−−10 pF
Data lines to card reader (pins I/O, AUX1 and AUX2; with integrated 11 kΩ pull-up resistors to V
CC
)
V
o(inactive)
output voltage inactive mode
no load 0 − 0.1 V
I
o(inactive)
=1mA −−0.3 V
I
o(inactive)
output current inactive mode; pin grounded −−−1mA
V
OL
LOW-level output voltage I
OL
= 1 mA 0 − 0.3 V
I
OL
≥ 15 mA V
CC
− 0.4 − V
CC
V
V
OH
HIGH-level output voltage no DC load 0.9V
CC
− V
CC
+ 0.1 V
5 and 3 V cards; I
OH
< −40 µA 0.75V
CC
− V
CC
+ 0.1 V
I
OH
≥10 mA 0 − 0.4 V
V
IL
LOW-level input voltage 0.3 − 0.8 V
V
IH
HIGH-level input voltage 1.5 − V
CC
+ 0.3 V
I
IL
 LOW-level input current V
IL
=0V −−600 µA
I
LIH
 HIGH-level input leakage
current
V
IH
=V
CC
−−10 µA
t
t(DI)
data input transition time V
IL(max)
to V
IH(min)
−−1.2 µs
t
t(DO)
data output transition time V
o
= 0 to V
CC
; C
L
≤ 80 pF;
10% to 90%
−−0.1 µs
R
pu
integrated pull-up resistor pull-up resistor to V
CC
91113kΩ
I
pu
current when pull-up active V
OH
= 0.9V
CC
; C = 80 pF −1 −− mA
SYMBOL PARAMETER CONDITIONS MIN. TYP MAX. UNIT