INTEGRATED CIRCUITS DATA SHEET TDA8024 IC card interface Product specification Supersedes data of 2003 Aug 19 2004 July 12
Philips Semiconductors Product specification IC card interface TDA8024 CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 ORDERING INFORMATION 5 QUICK REFERENCE DATA 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION 8.1 8.2 8.2.
Philips Semiconductors Product specification IC card interface 1 TDA8024 2 FEATURES APPLICATIONS • IC card interface • IC card readers for banking • 3 or 5 V supply for the IC (VDD and GND) • Electronic payment • Three specifically protected half-duplex bidirectional buffered I/O lines to card contacts C4, C7 and C8 • Identification • Pay TV.
Philips Semiconductors Product specification IC card interface 5 TDA8024 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Power supplies supply voltage VDDP DC/DC converter supply voltage VCC = 5 V; ICC < 80 mA 4.0 5.0 6.5 V VCC = 5 V; ICC < 20 mA 3.0 − 6.5 V supply current VDD = 3.3 V; fXTAL = 10 MHz card inactive − − 1.2 mA card active; fCLK = fXTAL; CL = 30 pF − − 1.5 mA inactive mode − − 0.
Philips Semiconductors Product specification IC card interface 6 TDA8024 BLOCK DIAGRAM 100 nF 100 nF VDD VDDP 6 S1 7 S2 5 SUPPLY 4 PGND DC/DC CONVERTER INTERNAL REFERENCE R1 (1) VDD 21 100 nF Vref PORADJ 18 INTERNAL OSCILLATOR 2.
Philips Semiconductors Product specification IC card interface 7 TDA8024 PINNING SYMBOL PIN TYPE DESCRIPTION CLKDIV1 1 I CLK frequency selection input 1 CLKDIV2 2 I CLK frequency selection input 2 5V/3V 3 I card supply voltage selection input; VCC = 5 V (HIGH) or VCC = 3 V (LOW) PGND 4 S DC/DC converter power supply ground S2 5 I/O VDDP 6 S S1 7 I/O DC/DC converter capacitor; connected between pins S1 and S2; C = 100 nF with ESR < 100 mΩ VUP 8 I/O DC/DC converter output
Philips Semiconductors Product specification IC card interface TDA8024 CLKDIV1 1 28 AUX2UC CLKDIV1 1 28 AUX2UC CLKDIV2 2 27 AUX1UC CLKDIV2 2 27 AUX1UC 5V/3V 3 26 I/OUC 5V/3V 3 26 I/OUC PGND 4 25 XTAL2 PGND 4 25 XTAL2 S2 5 24 XTAL1 S2 5 24 XTAL1 VDDP 6 23 OFF VDDP 6 23 OFF S1 7 22 GND S1 7 VUP 8 VUP 8 PRES 9 20 RSTIN PRES 9 19 CMDVCC PRES 10 TDA8024T PRES 10 21 VDD 18 PORADJ I/O 11 TDA8024TT 22 GND 21 VDD 20 RSTIN 19 CMDVCC 18 PORADJ I/O 11 AUX2
Philips Semiconductors Product specification IC card interface 8 TDA8024 The DC/DC converter function changes as follows: FUNCTIONAL DESCRIPTION • VCC = 5 V and VDDP > 5.8 V; voltage follower Throughout this document it is assumed that the reader is familiar with ISO7816 terminology. 8.1 • VCC = 5 V and VDDP < 5.7 V; voltage doubler • VCC = 3 V and VDDP > 4.1 V; voltage follower Power supply • VCC = 3 V and VDDP < 4.0 V; voltage doubler. The supply pins for the IC are VDD and GND.
Philips Semiconductors Product specification IC card interface 8.2.2 TDA8024 Transposed, this becomes WITH AN EXTERNAL DIVIDER ON PIN PORADJ (NOT TDA8024AT) FOR THE R1 0.99 R1 1 1 + 0.98 × ------- = 1 + ----------- × -------- < -- 1.01 R2 k R2 If an external resistor bridge is connected to pin PORADJ (R1 and R2 in Fig.1), then the following occurs: 1 1.01 R1 R1 --- < 1 + ----------- × ------- = 1 + 1.02 × ------- k 0.
Philips Semiconductors Product specification IC card interface 8.3 TDA8024 The crystal oscillator runs as soon as the IC is powered up. If the crystal oscillator is used, or if the clock pulse on pin XTAL1 is permanent, the clock pulse is applied to the card as shown in the activation sequences shown in Figs 7 and 8. Clock circuitry The card clock signal (CLK) is derived from a clock signal input to pin XTAL1 or from a crystal operating at up to 26 MHz connected between pins XTAL1 and XTAL2.
Philips Semiconductors Product specification IC card interface TDA8024 Table 2 FCE661 6 12 Io Vo Card presence indication OFF CMDVCC INDICATION HIGH HIGH card present LOW HIGH card not present (mA) (V) (1) If the card is in the reader (this is the case if PRES or PRES is active), the system microcontroller can start a card session by pulling CMDVCC LOW. The following sequence then occurs (see Fig.6): (2) 4 8 2 4 1.
Philips Semiconductors Product specification IC card interface TDA8024 handbook, full pagewidth CMDVCC VUP VCC ATR I/O CLK RSTIN RST I/OUC t0 t2 t4 t5 = tact t3 MDB054 t1 Fig.7 Activation sequence using RSTIN and CMDVCC. handbook, full pagewidth CMDVCC VUP VCC I/O ATR CLK 200 ns RSTIN RST I/OUC t0 t1 t2 t5 = tact t3 t4 MDB055 Fig.8 Activation sequence at t3.
Philips Semiconductors Product specification IC card interface 8.7 TDA8024 Active mode 1. RST goes LOW (t10). 2. CLK is held LOW (t12 = t10 + 0.5 × T) where T is 64 times the period of the internal oscillator (approximately 25 µs). When the activation sequence is completed, the TDA8024 will be in its active mode. Data is exchanged between the card and the microcontroller via the I/O lines.
Philips Semiconductors Product specification IC card interface 8.9 TDA8024 VCC generator There are two different cases (see Fig.10): • CMDVCC HIGH outside a card session. Output OFF is LOW if a card is not in the card reader, and HIGH if a card is in the reader. A voltage drop on the VDD supply is detected by the supply supervisor, this generates an internal Power-on reset pulse but does not act upon OFF. No short-circuit or overheating is detected because the card is not powered-up.
Philips Semiconductors Product specification IC card interface TDA8024 handbook, full pagewidth OFF PREST RST CLK I/O VCC VUP t12 t10 t13 t14 MDB057 tde t15 Fig.11 Emergency deactivation sequence (card extraction).
Philips Semiconductors Product specification IC card interface 9 TDA8024 LIMITING VALUES SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDD supply voltage −0.3 +6.5 V VDDP DC/DC converter supply voltage −0.3 +6.5 V VI, VO voltage on input and output pins pins XTAL1, XTAL2, 5V/3V, RSTIN, AUX1UC, AUX2UC, I/OUC, CLKDIV1, CLKDIV2, CMDVCC, OFF and PORADJ −0.3 +6.5 V Vcard voltage on card pins pins PRES, PRES, I/O, RST, AUX1, AUX2 and CLK −0.3 +6.
Philips Semiconductors Product specification IC card interface TDA8024 12 CHARACTERISTICS VDD = 3.3 V; VDDP = 5 V; Tamb = 25 °C; fXTAL = 10 MHz; all currents flowing into the IC are positive; see note 1; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP MAX. UNIT Temperature ambient temperature −25 − +85 °C VDD supply voltage 2.7 − 6.5 V VDDP DC/DC converter supply voltage 4.0 5.0 6.5 V VCC = 5 V; ICC < 20 mA 3.0 − 6.
Philips Semiconductors Product specification IC card interface SYMBOL TDA8024 PARAMETER CONDITIONS MIN. TYP MAX. UNIT DC/DC converter fCLK clock frequency card active 2.2 − 3.2 MHz Vth(vd-vf) threshold voltage for voltage doubler to change to voltage follower 5 V card 5.2 5.8 6.2 V 3 V card 3.8 4.1 4.4 V output voltage on pin VUP (average value) VCC = 5 V 5.2 5.7 6.2 V VCC = 3 V; VDDP = 3.3 V 3.5 3.9 4.3 V 80 − 400 nF card inactive; ICC = 0 mA −0.1 0 +0.
Philips Semiconductors Product specification IC card interface SYMBOL TDA8024 PARAMETER CONDITIONS MIN. TYP MAX. UNIT Crystal oscillator (pins XTAL1 and XTAL2) − − 15 pF crystal frequency 2 − 26 MHz fXTAL1 frequency applied on pin XTAL1 0 − 26 MHz VIL LOW-level input voltage on pin XTAL1 −0.3 − +0.3VDD V VIH HIGH-level input voltage on pin XTAL1 0.7VDD − VDD + 0.
Philips Semiconductors Product specification IC card interface SYMBOL PARAMETER TDA8024 CONDITIONS MIN. TYP MAX. UNIT Data lines to microcontroller (pins I/OUC, AUX1UC and AUX2UC; with integrated 11 kΩ pull-up resistors to VDD) VOL LOW-level output voltage IOL = 1 mA 0 − 0.3 VOH HIGH-level output voltage no DC load 0.9VDD − VDD + 0.1 V 5 and 3 V cards; IOH < −40 µA 0.75VDD − VDD + 0.1 V V VIL LOW-level input voltage −0.3 − +0.3VDD VIH HIGH-level input voltage 0.
Philips Semiconductors Product specification IC card interface SYMBOL PARAMETER TDA8024 CONDITIONS MIN. TYP MAX. UNIT tf fall time CL = 30 pF; note 5 − − 16 ns δ duty factor (except for fXTAL) CL = 30 pF; note 5 45 − 55 % SR slew rate slew up or down; CL = 30 pF 0.2 − − V/ns V Control inputs (pins CLKDIV1, CLKDIV2, CMDVCC, RSTIN and 5V/3V); note 6 VIL LOW-level input voltage −0.3 − +0.3VDD VIH HIGH-level input voltage 0.7VDD − VDD + 0.
Philips Semiconductors Product specification IC card interface TDA8024 Notes 1. All parameters remain within limits but are tested only statistically for the temperature range. When a parameter is specified as a function of VDD or VCC it means their actual value at the moment of measurement. 2. If no external bridge is used then, to avoid any disturbance, it is recommended to connect pin 18 to ground. Pin 18 is not connected in the TDA8024AT 3.
Philips Semiconductors Product specification IC card interface TDA8024 handbook, full pagewidth CLKDIV1 100 nF 10 µF CLKDIV2 5V/3V +5 V PGND 100 nF(1) 100 nF(1) +3.3 V 100 kΩ 1 28 2 27 3 26 4 25 S2 5 VDDP 6 S1 7 VUP TDA8024 8 PRES 9 PRES 10 I/O 11 AUX2 12 AUX1 13 CGND 14 24 AUX2UC AUX1UC I/OUC XTAL2 XTAL1 23 OFF GND 22 VDD 21 RSTIN 20 CMDVCC 19 PORADJ 18 VCC 17 RST 16 CLK 15 33 pF 3.3 V POWERED MICROCONTROLLER 100 nF +3.3 V(2) +3.3 V VDD (3) 58.
Philips Semiconductors Product specification IC card interface TDA8024 14 PACKAGE OUTLINES SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.
Philips Semiconductors Product specification IC card interface TDA8024 TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm D SOT361-1 E A X c HE y v M A Z 15 28 Q A2 (A 3) A1 pin 1 index A θ Lp 1 L 14 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 9.8 9.6 4.5 4.3 0.65 6.6 6.
Philips Semiconductors Product specification IC card interface TDA8024 To overcome these problems the double-wave soldering method was specifically developed. 15 SOLDERING 15.1 Introduction to soldering surface mount packages If wave soldering is used the following conditions must be observed for optimal results: This text gives a very brief insight to a complex technology.
Philips Semiconductors Product specification IC card interface 15.5 TDA8024 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE REFLOW(2) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..
Philips Semiconductors Product specification IC card interface TDA8024 16 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
