Datasheet

TDA8023_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 16 July 2007 3 of 32
NXP Semiconductors
TDA8023
Low power IC card interface
[1] Sum of currents on pins V
DD
and V
DDI
.
[2] Two ceramic multilayer capacitors of minimum 100 nF with low Equivalent Series Resistance (ESR) should be used in order to meet
these specifications.
[3] Output voltage towards the card, including ripple.
5. Ordering information
6. Block diagram
General
t
deact
deactivation time total sequence 60 80 100 µs
P
tot
total power dissipation T
amb
= −25 °C to +85 °C - - 500 mW
T
amb
ambient temperature −40 - +85 °C
Table 1. Quick reference data
…continued
V
DD
= 3.3 V; V
DD(INTF)
= 1.5 V; f
CLKIN
= 10 MHz; GND = 0 V; T
amb
= 25 ° C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Table 2. Ordering information
Type number Package
Name Description Version
TDA8023TT TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1
Fig 1. Block diagram with capacitive DC-to-DC converter
001aag336
100 nF
100 nF
C
CDEL
R1
R2
1 µF
100 nF 100 nF
100 nF
SUPPLY
SUPERVISOR
DC-TO-DC CONVERTER
I
2
C-BUS
INTERFACE
16
CLK
18
RST
VUP
GNDP
26
V
DDP
17
1
24
V
CC
19
PRES
3
SDWN
9
CLKIN
6
SCL
7
SAD0
8
SPRES
2
INT
4
V
DDI
10GND
20PORADJ
optional
external
resistor
bridge
21CDEL
15
GNDC
12
C8
13
C4
14
I/O
11
I/OUC
5
SDA
SEQUENCER
CLOCK
COUNTER
CARD
DRIVERS
TDA8023
22
V
DD
27
SBP
25
SBM
23
SAM
28
SAP